MARKET PULSE
SOX$7,833.39▲0.40%NVDA$177.39▲0.93%TSM$301.53▲1.18%INTC$41.53▲5.03%AMD$258.01▼0.64%QCOM$126.80▼0.38%ASML$1,052.48▼0.71%MRVL$102.30▲7.88%ARM$173.09▼3.18%AMAT$195.42▲1.21%SOX$7,833.39▲0.40%NVDA$177.39▲0.93%TSM$301.53▲1.18%INTC$41.53▲5.03%AMD$258.01▼0.64%QCOM$126.80▼0.38%ASML$1,052.48▼0.71%MRVL$102.30▲7.88%ARM$173.09▼3.18%AMAT$195.42▲1.21%
SOX INDEX7,833▲ +0.40% today
GLOBAL SEMI REVENUE (2025)$697B▲ +12.4% YoY
XPU MARKET (2025)$31B▲ Futurum Research
TSMC LEADING NODE YIELD2nmMass production 2026
AI INFRASTRUCTURETrump Announces Blockbuster Apple-Intel Chip Deal as ‘RAMmageddon’ Hits Tech Industry

Trump Announces Blockbuster Apple-Intel Chip Deal as ‘RAMmageddon’ Hits Tech Industry

President Donald Trump announced early Thursday that Apple Inc. has agreed to partner with Intel Corp. to design and manufacture its semiconductor chips domestically – a potentially big win for the White House’s aggressive campaign to reshore critical technology manufacturing to the U.S. through targeted tariffs and state-backed investments. Writing on Truth Social, Trump criticized […]

Jon Swartz · Jun 18, 2026 · 3 min
FEATUREDMemory Industry is Shifting to HBM at DRAM’s Expense

Memory Industry is Shifting to HBM at DRAM’s Expense

Because of demand from AI workloads, memory production is shifting away from standard DRAM toward High Bandwidth Memory (HBM), which is causing both a shortage of standard DRAM and a sharp increase in prices for the supply that is available. There are only three vendors of note in the world making both DRAM and HBM […]

Andy Patrizio · Jun 18, 2026 · 2 min
FAB & MFGSandboxAQ Wins $500M CHIPS Award for Semiconductor Materials Research

SandboxAQ Wins $500M CHIPS Award for Semiconductor Materials Research

The U.S. Department of Commerce has signed a definitive agreement to award SandboxAQ $500 million in CHIPS Act research funding to develop new chemicals and materials for semiconductor manufacturing. The Commerce Department said the award will fund the development and deployment of SandboxAQ’s ReAQT materials discovery platform, which uses the company’s Large Quantitative Models, or […]

Jaime Hampton · Jun 17, 2026 · 2 min
World-class semiconductor analysts delivering institutional-grade intelligence to Techstrong Semi readers

Meet the Analysts

Brendan Burke headshot

Brendan Burke

Research Director, Semiconductors

Leads Futurum's Semiconductors Practice covering edge AI, generative AI, and hyperscale silicon architectures.

Nick Patience headshot

Nick Patience

VP & Practice Lead, AI Platforms

25+ years covering AI and enterprise software. Co-founded 451 Research. London-based analyst covering AI platforms and infrastructure.

Olivier Blanchard headshot

Olivier Blanchard

Research Director, Intelligent Devices

Covers intelligent devices, edge AI, sustainability, and the convergence of silicon and software at the edge.

Keith Kirkpatrick headshot

Keith Kirkpatrick

VP & Research Director, Enterprise Software

Covers enterprise applications, digital workflows, and the intersection of AI with enterprise software strategies.

Meet the full analyst team →

Deep Analysis

View All →
01
MEMORY & STORAGE

AWS Summit NY 2026: Is AI Infrastructure AWS’s Real Agentic Moat?

At AWS Summit New York 2026, AWS AI infrastructure — G7 Blackwell GPUs, QuEra quantum, AMD Outposts, and RGN networking — anchors its agentic push.

Brendan Burke·Jun 25, 2026·7 min
02
ANALYSIS

Will a U.S. Quantum Foundry Leverage $4.6 Billion in New Capital to Become the Next TSMC?

With $4.6B in new capital, is a U.S. Quantum Foundry set to become the next TSMC? Learn how recent investments are reshaping quantum manufacturing.

Brendan Burke·Jun 24, 2026·10 min
03
AI SILICON

Can AMD and Rackspace Scale Sovereign AI Inference?

AMD and Rackspace’s partnership deploys 30 MW AI compute capacity for regulated enterprise environments starting late 2026.

Brendan Burke·Jun 23, 2026·5 min
04
AI SILICON

Will the First Wave of Synopsys Multiphysics Fusion Start the Next Wave of AI Chip Designs?

Synopsys Multiphysics Fusion solutions embed Ansys signoff analysis into design workflows, accelerating AI chip design with up to 10x faster closure.

Brendan Burke·Jun 23, 2026·7 min

Opinion & Commentary

👑

PREMIUM INTELLIGENCE

Institutional-grade research, proprietary data, and analyst access — reserved for premium subscribers

UNLOCK PREMIUM ACCESS
Includes: Full research library, quarterly data reports, analyst briefings, and early access to all Futurum semiconductor research.
View All Events →
JUN4
WEBINAR

From Experimentation to Production: Why Inference Is the Defining Layer of AI

CoreWeave-sponsored webinar examining why operationalizing AI inference at scale — not training new models — is the real challenge facing enterprises in 2026.

Watch On-Demand →
MAY1
WEBINAR

Breaking the Wall: How CharacterAI Scaled AI Inference to Millions with AMD and DigitalOcean

On-demand webinar with CharacterAI’s Chief Architect on how AMD MI325X accelerators with 256GB HBM and DigitalOcean enabled production-scale inference on half the hardware.

Watch On-Demand →
MAY20
WEBINAR

Bare Metal at AI Speed

RackN webinar on building AI infrastructure automation for bare metal at scale — covering operator challenges and high-speed, large-scale bare metal management with AIOps.

Watch On-Demand →
MAY27
WEBINAR

Beyond Embedded! RISC-V in the Performance CPU segment

RISC-V is commonly seen as an ISA for embedded products; for smaller devices that require low power consumption but aren’t very complex and can tolerate lower performance. SiFive, a leading RISC-V IP vendor, is proving that incorrect with its Performance family of products. They recently launched the latest product in the series, the P550, that supports the RVA23 profile: a crucial enabler for SW developers and the industry as a whole. In this webinar, we discuss how SiFive has been able to deli

Watch On-Demand →
MAY27
WEBINAR

The AI Reality Check – Operationalizing for Business Value

There has never been a megatrend as transformative as AI. 2023 unlocked new possibilities, 2024 brought new proof of concepts and 2025 was the year to prove the ROI and business value generation of AI. 2026 is the year of the AI reality check and organizations that successfully operationalize AI to drive concrete efficiency and measurable impact will be the ultimate winners.

Watch On-Demand →
JUN4
WEBINAR

From Experimentation to Production: Why Inference Is the Defining Layer of AI

As AI adoption accelerates, organizations are discovering that the real challenge is no longer building models—it’s running them reliably at scale. This webinar explores the growing “production AI gap,” where promising prototypes fail to translate into consistent, real-world outcomes. Attendees will gain a clearer understanding of why inference—not training—is becoming the defining layer of AI, and what it takes to operationalize AI systems in environments shaped by unpredictable demand, latency

Watch On-Demand →

Want to sponsor an event or host a webinar with Techstrong & Futurum?

Become a Sponsor