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Xianrui Dou

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

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2026
[j4]
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  dblp key:
  - journals/tcad/DouLHLCL26
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  - https://dblp.org/rec/journals/tcad/DouLHLCL26
Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Tian Chen, Jun Liu:
Ring Oscillator-Based PreBond TSV Testing Method With Classification and Grading of Defects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 45(1): 387-395 (2026)
2025
[j3]
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  - journals/tcasII/DouLHLWCL25
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  - https://dblp.org/rec/journals/tcasII/DouLHLWCL25
Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Yue Wang, Tian Chen, Jun Liu:
Prebond Test of TSV Based on Voltage Skew Amplification. IEEE Trans. Circuits Syst. II Express Briefs 72(11): 1770-1774 (2025)
[j2]
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  - journals/tvlsi/DouLHLCY25
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  - https://dblp.org/rec/journals/tvlsi/DouLHLCY25
Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Tian Chen, Maoxiang Yi:
Pulse-Based Prebond TSV Testing. IEEE Trans. Very Large Scale Integr. Syst. 33(5): 1215-1223 (2025)
[j1]
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  - journals/tvlsi/LiangXDNLH25
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  - https://dblp.org/rec/journals/tvlsi/LiangXDNLH25
Huaguo Liang, Jiahui Xiao, Xianrui Dou, Tianming Ni, Yingchun Lu, Zhengfeng Huang:
A TSV Misalignment-Based Repair Architecture in 3-D Chips. IEEE Trans. Very Large Scale Integr. Syst. 33(7): 1816-1825 (2025)
[c2]
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  dblp key:
  - conf/itc-asia/LiangLCD25
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  - https://dblp.org/rec/conf/itc-asia/LiangLCD25
Zhongyuan Liang, Huaguo Liang, Weikun Chen, Xianrui Dou:
A High-Precision Pre-Bond TSV Delay-Fault Detection Technique Using Digitally Controlled Delay Lines. ITC-Asia 2025: 7-12
2024
[c1]
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  - conf/3dic/LiLDYHLJ24
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Junming Li, Huaguo Liang, Xianrui Dou, Le Yu, Zhengfeng Huang, Yingchun Lu, Cuiyun Jiang:
Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects. 3DIC 2024: 1-6

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