Bold People.
Bright Ideas.

Teradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high resolution imaging in any weather condition. Founded in Boston, Teradar’s solid-state, chip-scale technology unlocks safer, smarter vehicles and opens the door to transformative applications in mobility, defense, and beyond.

Location: Boston,  MA

Role

As a Defense Customer Engineer, you will serve as a key technical liaison between the company and its customers, providing hands-on technical support, guidance, and expertise. You will play a critical role in demonstrating product capabilities, eliciting requirements, analyzing sensor performance, assisting with integration, and ensuring successful deployment of this sensor technology.This is an exciting opportunity to bring novel sensing technology to address critical defense customer capability gaps.

Responsibilities

• Act as the primary technical interface for customers, providing guidance on product integration, troubleshooting, and performance optimization.
• Analyze sensor performance from customer demonstrations and test events.
• Generate requirements for sensor performance in novel defense use cases.
• Develop documentation and presentation materials for delivery to customers.
• Conduct product demonstrations and live showcases, explaining the capabilities and advantages of the company’s sensor solutions.
• Collaborate closely with internal engineering teams to relay customer feedback and ensure alignment between product development and customer needs.
• Support customers through the full product lifecycle, from evaluation and proof-of-concept to mass production.
• Develop and present technical documentation, training materials, and application notes to assist customers in understanding and utilizing the technology.
• Identify and resolve technical challenges in customer implementations, working hands-on with hardware and software.
• Travel as needed to customer sites for meetings, demonstrations, and technical support.

Qualifications

• Proven experience in an engineering role supporting the lifecycle of sensor development from requirements generation, development, and test. 
• Strong background in Sensor Hardware, Signal Processing, RF, radar, LiDAR, or related sensor technologies.
• Proven experience translating customer capability gaps into product requirements.
• Background in analyzing sensor performance data for product improvement and customer presentation.
• Ability to translate complex technical concepts into clear, customer-friendly explanations.
• Hands-on experience with product testing, debugging, and integration.
• Strong problem-solving skills and ability to work in a fast-paced start-up environment.
• Excellent communication and interpersonal skills to engage with both technical and non-technical stakeholders.
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Systems Engineering or a related technical field.
• Willingness to travel to customer sites and industry events.

Department: Engineering — Verification & Validation
Reports To: Director of Systems Engineering / VP of Engineering
Location: Boston | Travel Required: Up to 30%
Employment Type: Full-Time

ABOUT THE ROLE

We are seeking an experienced and driven Verification & Validation (V&V) Team Lead to own and lead the validation strategy for next-generation automotive sensor systems. This role is critical to ensuring our sensor products meet the highest standards of quality, safety, and reliability demanded by Tier 1 and OEM automotive customers.

As the V&V Team Lead, you will be the technical authority for all aspects of sensor validation — from requirements traceability through system, subsystem, and vehicle-level testing — while ensuring full compliance with functional safety (FuSA/ISO 26262) and automotive grade standards (AEC-Q, IATF 16949). You will lead a cross-functional, geographically distributed team and serve as the primary technical interface with customers.

KEY RESPONSIBILITIES

Leadership & Strategy

• Lead, mentor, and grow a team of V&V engineers across multiple sites and regions
• Define and own the overall V&V strategy for automotive sensor products from concept through production release
• Establish V&V team processes, tools, and best practices aligned with automotive industry standards
• Drive a culture of rigor, repeatability, and continuous improvement within the V&V organization
• Partner closely with Systems Engineering, Hardware, Software, and Systems Architecture teams to align validation efforts with product development milestones

Requirements Traceability

• Own and manage requirements traceability matrices (RTM) from system-level requirements down to individual test cases
• Ensure complete bidirectional traceability between customer requirements, internal specifications, and verification evidence
• Work with systems engineers to review, challenge, and clarify ambiguous or incomplete requirements
• Maintain traceability artifacts in tools such as DOORS, Jama, Polarion, or equivalent

Test Planning & Methodology

• Develop comprehensive test plans, test methodologies, and test procedures for sensors including radar, LiDAR, camera, or inertial sensors
• Define test coverage strategies across unit, subsystem, system, and vehicle levels
• Establish pass/fail criteria grounded in customer specs, internal requirements, and regulatory standards
• Identify test gaps and drive resolution through risk-based analysis

System, Subsystem & Vehicle Testing

• Lead execution of HIL (Hardware-in-the-Loop), SIL (Software-in-the-Loop), and bench-level testing for sensor subsystems
• Plan and execute vehicle-level validation campaigns including track testing, public road testing, and environmental testing
• Coordinate environmental and stress testing (temperature, vibration, EMC, humidity) per automotive standards
• Define and manage test environments, fixtures, and configurations that are repeatable, reproducible, and well-documented
• Ensure test setups meet automotive grade requirements and are suitable for regulatory and customer audits

Functional Safety (FuSA) Compliance

• Lead V&V activities in compliance with ISO 26262 including safety validation planning, safety analysis reviews, and validation reporting
• Collaborate with the FuSA team to ensure all ASIL-rated requirements are fully verified with appropriate rigor and independence
• Maintain and deliver safety case evidence as required for FuSA sign-off and customer approval
• Support FMEA, FTA, FMEDA, and HARA activities from a validation perspective

Data Collection & Database Management

• Define and oversee data collection strategies for vehicle testing, sensor characterization, and performance benchmarking
• Establish and maintain a structured test data repository enabling efficient retrieval, analysis, and reporting
• Ensure data integrity, version control, and traceability of all test results and datasets
• Leverage data analysis tools (MATLAB, Python, SQL, or equivalent) to extract actionable insights from large test datasets

Test Automation

• Champion and drive automation of test execution, data collection, and reporting workflows to accelerate validation cycles
• Evaluate, select, and implement automation frameworks and tools (e.g., CANoe, LabVIEW, Python-based frameworks, Robot Framework)
• Build automation infrastructure that supports regression testing and continuous validation pipelines
• Reduce manual test burden while increasing test coverage and repeatability

Customer & Stakeholder Interface

• Act as the primary technical point of contact for customers on all V&V-related topics
• Present test plans, validation status, and results to customers and OEM stakeholders with clarity and confidence
• Respond to customer validation requests, audit findings, and 8D corrective actions in a timely and professional manner
• Support customer PPAP submissions, DVP&R (Design Verification Plan & Report), and production readiness reviews

Cross-Functional & Regional Collaboration

• Work effectively with cross-functional teams including Systems, Hardware, Software, Manufacturing, and Quality Engineering
• Coordinate V&V activities across teams in multiple regions and time zones, ensuring alignment, clear communication, and on-time delivery
• Participate in program reviews, gate reviews, and design reviews as the V&V representative
• Communicate risks, issues, and escalations proactively to program management and leadership

REQUIRED QUALIFICATIONS

• Bachelor’s or Master’s degree in Electrical Engineering, Systems Engineering, Mechanical Engineering, or related field
• 8+ years of experience in verification and validation in the automotive industry
• 3+ years in a team lead or technical leadership role
• Hands-on experience with automotive sensor systems (radar, LiDAR, camera or IMU)
• Deep understanding of ISO 26262 (Functional Safety) and experience delivering FuSA-compliant validation evidence
• Proven experience developing test plans, test procedures, and DVP&R documents
• Strong background in requirements management and traceability using tools like DOORS, Jama, or Polarion
• Experience with vehicle-level testing including test track, proving ground, and real-world drive testing
• Proficiency in test automation tools and scripting (Python, MATLAB, LabVIEW, CANoe, or similar)
• Solid understanding of automotive grade standards (AEC-Q, IATF 16949, ISO/IEC 17025)
• Experience managing test databases and data pipelines for large-scale test data
• Strong communication and presentation skills with experience in direct customer-facing roles
• Comfortable working in a global, matrixed organization with teams across multiple regions

PREFERRED QUALIFICATIONS

• Experience with ADAS or autonomous driving sensor validation
• Familiarity with AUTOSAR, CAN, Ethernet, or other automotive communication protocols
• Knowledge of cybersecurity standards (ISO/SAE 21434) as applied to automotive sensors
• Experience with HIL/SIL environments (dSPACE, NI, Vector, or similar)
• Certifications in ISO 26262, Six Sigma, or ASPICE
• Experience supporting PPAP and production launch activities
• Prior experience working with Tier 1 or OEM automotive customers in a validation capacity

WHAT WE OFFER

• Competitive salary and performance-based bonus
• Comprehensive benefits package (medical, dental, vision, 401k)
• Opportunity to work on cutting-edge automotive sensor technology
• Collaborative and innovative engineering culture
• Professional development and conference participation support
• Flexible work arrangements where applicable

WORK ENVIRONMENT

This role operates in a laboratory, office, and vehicle test environment. Candidates must be comfortable working in outdoor test track conditions, handling sensor hardware, and occasionally traveling to customer sites, proving grounds, or regional engineering offices.

We are an equal opportunity employer and value diversity in our workforce. We encourage candidates of all backgrounds to apply.

Teradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high-resolution imaging in any weather condition. Founded in Boston, Teradar’s solid-state, chip-scale technology unlocks safer, marter vehicles and opens the door to transformative applications in mobility, defense, and beyond.

We are looking to hire an IC Packaging Engineer who will own the development and delivery of advanced packaging solutions for THz system RFIC & SoC applications. This is a high-impact role that combines technical leadership, hands-on thermo-mechanical and physical design, and vendor management to bring cutting-edge multi-chip packages into production.

Location: San Jose CA (hybrid)

Responsibilities

• Technical leadership, guiding and personally executing the physical and structural design of advanced IC packages for multi-chip RFIC/SoC integration.
• Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.
• Work on single-sided and double-sided RDL designs and on-package RF antenna structures.
• Hands-on execution of structural, warpage, and thermal simulations using tools such as ANSYS to ensure package integrity under harsh automotive conditions.
• Co-optimize package designs for thermal, mechanical, and physical layout performance, collaborating closely with dedicated internal SIPI, RFIC, and digital teams.
• Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).
• Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.
• Create and review detailed mechanical analysis and drawings, substrate stack-ups, physical layout constraints, and co-review electrical performance boundaries.
• Lead failure analysis and root cause investigations for packaging and reliability issues and provide structural solutions to increase yield.
• Contribute to the packaging roadmap and scalability plan for automotive volume production.

Key Qualifications

• 10+ years of experience in IC packaging design and development, including leadership responsibilities and a strong track record of hands-on physical and mechanical design execution.
• Proven track record with multi-chip packages, digital + RF integration, and automotive applications.
• Deep expertise in thermo-mechanical management, mechanical stress analysis, warpage control, and package reliability modeling.
• Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.
• Deep knowledge of UCIe interconnects, organic substrates, interposers, and advanced packaging architectures.
• Experience with RF antenna integration in package designs.
• Strong working knowledge of package electrical layouts and layout constraints, with the ability to bridge physical designs with SIPI requirements.
• Established network with packaging vendors and OSATs.
• M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
• Excellent communication skills and ability to thrive in a fast-paced start-up environment.

Why Join

• Technical oversight and design execution, defining packaging solutions for breakthrough ADAS technology.
• Collaborate with a world-class engineering team spanning RFIC, SoC, and system design.
• Be part of a well-funded start-up bringing innovative sensing technology to market.
• Competitive compensation, stock options, and flexible work arrangements.

Teradar is seeking a driven and organized RF Systems Engineer with a background in radar systems, RF, or electromagnetics to help bring the world’s first THz phased array imaging system to market.

You’ll work cross-functionally with IC design, antenna/array, signal processing, PCB, packaging, and software teams to support system integration, testing, and characterization of internally developed mmWave ICs. You’ll also play a key role in improving performance, measurement techniques, and scaling system testing.

Most days will involve hands-on debugging and OTA testing of chips and subsystems; others will focus on developing new calibration and test methods and driving implementation logistics. Your work will be central to the technical success and scale-up of the company’s next-gen radar platform.

What You Will Do

• Perform system integration and bring up new versions of the radar system
• Develop and implement new measurement and calibration methods for the radar system
• Develop processes and automation for characterizing a high volume of systems across
• process and temperature corners.
• Solve or participate in solving customer facing system capability improvements
• Manage hardware responsibilities for phased array characterization and analog
• beamforming
• Debug issues with system performance.
• Characterize chipsets over the air using VNAs, spectrum analyzers and frequency extender modules

What You Will Bring 

• Advanced experience with phased array radars
• Experience working at a start-up or high-growth oriented company
• Eager to learn new material, especially related to RF test methods as well as RF system
• design and integration.
• Experience doing over the characterization of antennas and beamforming networks
• System and device level understanding of amplifiers, mixers, phase shifters and other RF components.
• Experience using VNAs, spectrum analyzers and other high frequency lab equipment.
• Strong attention to detail, project/time management, and organizational skills

Location
Boston MA (onsite)

If your jam is low-level programming, high-performance DSPs, and working close to the metal, this one’s for you.

What You Will Do 

• Profile, analyze, and optimize performance, power, and area trade-offs in software designs.
• Develop and optimize embedded software for high-performance multicore DSP platforms.
• Leverage SIMD, VLIW, and fractional arithmetic techniques to deliver efficient signal processing and linear algebra algorithms.
• Work closely with hardware design teams to understand instruction set architectures (ISA) and micro-architectures details, ensuring software takes full advantage of the hardware.
• Integrate DMA strategies to maximize data throughput.
• Build, use, and maintain pre-silicon validation platforms such such as virtual prototypes for early software development and testing.

What You Will Bring

• Strong experience programming for embedded processors or low-level systems.
• Solid understanding of computer architecture and micro-architecture fundamentals.
• Hands-on experience with SIMD and VLIW programming models.
• Knowledge of DMA integration in embedded systems.
• Familiarity with fractional arithmetic in DSP applications.
• Experience working with instruction set architecture (ISA) documentation or development.
• Exposure to virtual prototypes or pre-silicon validation platforms.
• Proficiency in C/C++, Assembly, Intrinsics
• Ability to analyze performance bottlenecks and optimize for PPA.

Bonus Points 

• Individuals who have worked with CEVA DSPs, particularly the SensePro family (SP500/SP1000) and MRD accelerators, will be exceptionally well-suited for this role.
• Familiarity with CEVA’s instruction set, toolchains, and performance optimization techniques will be highly advantageous, especially in the context of high-performance signal processing for sensing applications.

Location
Boston MA (hybrid)